1. Industry Introduction
The adhesive technology used in the LED assembly process is suitable for various applications, such as encapsulation of silicone fluorescent powder cavities, bonding of fluorescent plates, and related applications for connecting or packaging LEDs on other substrates.

2. Process characteristics
Of particular concern for the encapsulation of LED silicone fluorescent powder cavities is:
The accuracy and consistency of the adhesive amount ensure the achievement of the target LED color
• High production capacity (unit output; UPH) minimizes cost of ownership
Maintain the fluorescent powder colloid in a consistent fluid state during the production cycle

3. Solution
LENS Assembly Special SE-510L Series Spray Glue System
a) Assembly line production mode
b) Centralized production mode