Equipment Introduction:
1. Mainly used for semiconductor packaging testing, the front-end BGA board of the washing line is transported to the back-end equipment through a material frame (clip) storage method, with automatic feeding function
2. PLC control, touch screen operation, standard SMEMA signal port,
3. Linear module with servo control for lifting and translation.
4. The board feeding method adopts motor and thrust overload protection to ensure that the BGA board will not be damaged.
5. The frame replacement method adopts an automatic cycle of upper and lower layer frame replacement.
6. Material frame capacity: two on top and two on bottom
7. Standard network ports, supporting communication expansion
8. Production cycle: 8-12 S/PCS
9. Conveyor height: 900 ± 30;
10. Power/Voltage: 1.5KW; 220V/50HZ
11. Working pressure: 0.5-0.8Mpa
Equipment parameters:
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1
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Machine Dimensions
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L500*W1150*H1500(mm)(Depending on the actual situation)
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2
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Power Supply
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AC220±10％ 50/60hz 2.5KW
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3
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Air Supply
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0.5Mpa-0.8Mpa
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4
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Air consumption
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20L/min
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5
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Operating System
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PLC+TOUCH SCREEN CONTROLLER
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6
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Machine Weight
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make an appointment 200KG
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