Inverted chip soldering flux dispensing


1. Industry Introduction
Flux dispensing is another important flip chip packaging process. It can remove the oxide layer on the surface of circuit boards and bumps, improve the wetting effect of solder and the reliability of bonding. Before bonding the flip chip, flux must be applied to the bump or substrate surface of the flip chip. Many chip soldering machines use a flux dipping system, in which the flip chip bumps are immersed in a thin layer of flux coating before being connected to the substrate.


2. Process characteristics
The application amount is appropriate to avoid excessive solder flux and contamination of the top of the chip. Excessive residual flux can cause equipment failure.
The application should be uniform, and the flux should be applied unevenly. Some bumps may not have been coated with flux.


3. Solution
Desktop dispensing machine PE441T series and online visual high-speed dispensing machine SE series